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Home Technology peripherals It Industry SK hynix's innovative semiconductor CMP polishing pad technology enables sustainable use

SK hynix's innovative semiconductor CMP polishing pad technology enables sustainable use

Dec 28, 2023 pm 11:04 PM
semiconductor Hynix Semiconductor industry

According to news from this website on December 27, according to Korean media ETNews, SK Hynix has recently developed reusable CMP polishing pad technology, which can not only reduce costs, but also enhance ESG (environmental) , society, governance) management.

SK Hynix stated that they will first deploy reusable CMP polishing pads in low-risk processes and gradually expand their application scope

Note on this site: CMP technology is to enable polished It is a process in which the surface of the material reaches the required flatness under the combined action of chemistry and machinery. The chemical components in the polishing fluid react chemically with the material surface to form a softened layer that is easy to polish. The polishing pad and abrasive particles in the polishing fluid physically and mechanically polish the material surface to remove the softened layer.

SK 海力士開(kāi)發(fā)出可重復(fù)使用的半導(dǎo)體 CMP 拋光墊技術(shù)
Source: Dinglong Co., Ltd.

In the CMP process, the main functions of the polishing pad are:

  • In order to achieve uniform distribution of the polishing fluid to the entire processing area and provide new supplementary polishing fluid for circulation, the following operations need to be performed:

  • Clear due to the polishing process The resulting residues on the workpiece surface, such as polishing chips, chips, etc.

  • Need to eliminate the required mechanical load when transferring the material;

  • It is very important to maintain the mechanical and chemical environment required for the polishing process. In addition to the mechanical properties of the polishing pad, the structural characteristics of the surface also have an impact on polishing efficiency and flatness. For example, the shape of micropores, porosity, and groove shape will affect the flow and distribution of the polishing fluid

SK Hynix uses the CMP polishing pad dial texture reconstruction method to ensure Polishing pads can be reused

About 70% of CMP polishing pads in South Korea use foreign products and are highly dependent on foreign countries. However, by breaking through this technology, the further independent development of the Korean semiconductor industry can be promoted

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According to news from this website on December 27, according to Korean media ETNews, SK Hynix has recently developed reusable CMP polishing pad technology, which can not only reduce costs, but also enhance ESG (environmental, social, governance) management. SK Hynix said that they will first deploy reusable CMP polishing pads in low-risk processes and gradually expand their application scope. Note: CMP technology is to make the surface of the material to be polished under the combined action of chemicals and mechanics. A process to achieve the required flatness. The chemical components in the polishing fluid react chemically with the material surface to form a softened layer that is easy to polish. The polishing pad and abrasive particles in the polishing fluid physically and mechanically polish the material surface to remove the softened layer. Source: Dinglong shares in CM

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