According to news from this site on April 17, TrendForce recently released a report, believing that demand for Nvidia's new Blackwell platform products is bullish, and is expected to drive TSMC's total CoWoS packaging production capacity to increase by more than 150% in 2024. NVIDIA Blackwell's new platform products include B-series GPUs and GB200 accelerator cards integrating NVIDIA's own GraceArm CPU. TrendForce confirms that the supply chain is currently very optimistic about GB200. It is estimated that shipments in 2025 are expected to exceed one million units, accounting for 40-50% of Nvidia's high-end GPUs. Nvidia plans to deliver products such as GB200 and B100 in the second half of the year, but upstream wafer packaging must further adopt more complex products.

It is not certain who made the 1nm chip. From a research and development perspective, the 1nm chip was jointly developed by Taiwan, China and the United States. From a mass production perspective, this technology is not yet fully realized. The main person in charge of this research is Dr. Zhu Jiadi of MIT, who is a Chinese scientist. Dr. Zhu Jiadi said that the research is still in its early stages and is still a long way from mass production.

News from this site on November 13, according to Taiwan Economic Daily, TSMC’s CoWoS advanced packaging demand is about to explode. In addition to NVIDIA, which has confirmed expanded orders in October, heavyweight customers such as Apple, AMD, Broadcom, and Marvell have also recently pursued orders significantly. According to reports, TSMC is working hard to accelerate the expansion of CoWoS advanced packaging production capacity to meet the needs of the above-mentioned five major customers. Next year's monthly production capacity is expected to increase by about 20% from the original target to 35,000 pieces. Analysts said that TSMC's five major customers have placed large orders, which shows that artificial intelligence applications have become widely popular, and major manufacturers are interested in artificial intelligence chips. The demand has increased significantly. Inquiries on this site found that the current CoWoS advanced packaging technology is mainly divided into three types - CoWos-S

The latest news shows that according to reports from the Science and Technology Innovation Board Daily and Blue Whale Finance, industry chain sources revealed that NVIDIA has developed the latest version of AI chips suitable for the Chinese market, including HGXH20, L20PCle and L2PCle. As of now, NVIDIA has not commented. People familiar with the matter said that these three chips are all based on improvements from NVIDIA H100. NVIDIA is expected to announce them as soon as November 16, and domestic manufacturers will get samples as soon as these days. After checking public information, we learned that NVIDIAH100TensorCoreGPU adopts the new Hopper architecture, which is based on TSMC N4 process and integrates 80 billion transistors. Compared with the previous generation product, it can provide multi-expert (MoE)

News from this site on November 28. According to the official website of Changxin Memory, Changxin Memory has launched the latest LPDDR5DRAM memory chip. It is the first domestic brand to launch independently developed and produced LPDDR5 products, achieving a breakthrough in the domestic market and also making Changxin Storage's product layout in the mobile terminal market is more diversified. This website noticed that Changxin Memory LPDDR5 series products include 12Gb LPDDR5 particles, POP packaged 12GBLPDDR5 chips and DSC packaged 6GBLPDDR5 chips. The 12GBLPDDR5 chip has been verified on models of mainstream domestic mobile phone manufacturers such as Xiaomi and Transsion. LPDDR5 is a product launched by Changxin Storage for the mid-to-high-end mobile device market.

According to news from this website on April 10, according to the Liberty Times, TSMC plans to send Dr. Zhuang Zishou to the United States in May this year to cooperate with Wang Yinglang to jointly promote the construction of TSMC’s US factory. The U.S. Department of Commerce has currently finalized the amount of subsidies for TSMC, Intel, and Samsung, but TSMC's factories in the United States still have many problems. TSMC’s leadership hopes to promote the implementation of advanced processes as soon as possible by sending Dr. Zhuang Zishou to work with Wang Yinglang, who specializes in production and manufacturing. Check out the official TSMC leadership team on this site: Dr. Zhuang Zishou is currently the deputy general manager of factory affairs at TSMC, responsible for the planning, design, construction and maintenance of new factories, as well as the operation and upgrade of existing factory facilities. Dr. Zhuang joined TSMC in 1989 as a

According to news from this website on November 25, financial analyst Dan Nystedt recently pointed out that based on the financial report data of various companies in the third quarter of 2023, Nvidia surpassed TSMC and Intel and took the top spot in the chip industry revenue. Nvidia’s revenue in the third fiscal quarter was US$18.120 billion (note on this site: currently about 129.377 billion yuan), an increase of 206% compared with US$5.931 billion in the same period last year, and an increase compared with US$13.507 billion in the previous fiscal quarter. 34%. NVIDIA's net profit in the third fiscal quarter was US$9.243 billion (currently approximately 65.995 billion yuan), an increase of 1259% compared with US$680 million in the same period last year, and an increase of 49% compared with US$6.188 billion in the previous fiscal quarter.

According to news from this site on October 31, the Economic Daily learned from industry insiders that Pioneer International Semiconductor/World Advanced (VIS) is currently negotiating with AUO's Singapore factory to acquire the land and equipment held by the latter and use it to Construction of the first 12-inch wafer fab. Source: AUO’s official website Pioneer International Semiconductor plans to invest US$2 billion (approximately RMB 14.64 billion) to produce chips, mainly for the automotive field. According to reports, Pioneer International Semiconductor will hold a relevant meeting on November 7. AUO plans to hold a relevant meeting on October 31. The two companies have not yet issued official comments on the relevant rumors. Reports indicate that AUO plans to gradually withdraw its development focus in Singapore from manufacturing to establishing a regional service center. This Singapore factory was established in 201